China’s Chip Bubble Burst as Top Players Fall From Grace | Chip Scam | Integrated Circuit
China’s Chip Bubble Burst as Top Players Fall From Grace | Chip Scam | Integrated Circuit
China’s Chip Bubble Burst as Top Players Fall From Grace | Chip Scam | Integrated Circuit
China's Great Leap Forward campaign to build chips has resulted in project failure and corporate bankruptcy, which also means that the chip investment bubble has burst. The resulting huge losses naturally require someone to take responsibility. Recently, China suddenly set off a "chip anti-corruption" storm, the Minister of Industry and Information Technology, the seniors of the semiconductor "national fund", and a number of former and current top executives of chip giant Tsinghua Unigroup have fallen. According to internal sources, the anti-corruption campaign, which triggered a major earthquake in the chip industry, stemmed from a question Xi Jinping asked of the chip industry in early July.
On July 30, the CCP Central Commission for Discipline Inspection announced that Ding Wenwu, general manager of the National Integrated Circuit Industry Investment Fund, commonly known as the "big fund", was under investigation